Advantages：

1. Zero missed detection, low over detection, precise sorting.
2. No cause edge collapse, hidden cracks, or fragments, and the entire process is smooth and safe.
3. The material is docked with an automatic packaging machine, and the entire process does not require manual intervention.
4. Share data with washing machines and packaging machines, provide comprehensive information flow, and improve the overall process quality.
5. Each detection component adopts a modular design, realizing the free combination of multiple modules and can be selected as needed.

Parameters：

1. UPH: 15000@whole piece, 30000@half piece.
2. Operating speed: 1500mm/s.
3. Sorting boxes: 18 sorting positions, 37 feeding boxes.
4. Noise: ≤75dB.
5. Power supply: three-phase five wire system 380±10% VAC, 50Hz±2%, 10/15kW average/maximum.
6. Gas supply: 0.5-0.7MPa, 350L/min.
7. Detection: Misdetection rate: 0, pass rate: 0.5%.
*The above parameters are subject to the actual product.

Applications：

1. Compatible with 166mm~230mm silicon wafers.
2. Compatible with silicon wafers with a thickness of 90μm~240μm.
3. Basket style feeding.